| 张辉,邹红,叶文霞,谢荔珍.火场中纸面石膏板显微结构的SEM分析[J].火灾科学,2007,16(3):162-165. |
| 火场中纸面石膏板显微结构的SEM分析 |
| SEM Analysis of Microstructure of Thistle Board in Fire Scene |
| 投稿时间：2007-04-29 修订日期：2007-05-16 |
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| DOI：10.3969/j.issn.1004-5309.年.期.顺序 |
| 基金项目: |
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| 中文关键词: 纸面石膏板 显微结构 SEM 火场温度 |
| 英文关键词:thistle board microstructure SEM temperature of fire scene |
| 摘要点击次数: 419 |
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| 中文摘要: |
| 运用SEM(扫描电子显微镜),对经历不同火场温度的纸面石膏板试块的显微结构进行观察和分析。结果表明:纸面石膏板在受热时,其组成、结构将发生改变。当受热温度达到300℃时,护面纸与石膏芯材的结合松动,护面纸发生热分解、炭化,以及石膏芯材网状晶体骨架结构疏松、断裂、破碎,完整性遭到破坏,强度基本丧失;受热温度越高,纸面石膏板显微结构的破坏越严重。 |
| 英文摘要: |
| Microstructure of thistle board undergoing different temperatures of fire scene was observed and analyzed by using SEM.The results showed that the composition and construction of thistle board vary with the heating temperature.When the heating temperature reaches 300℃,the bond between face-sheet paper and sandwiched-in gypsum becomes loosening.The paper undergoes thermal decomposition and charring,and net-shaped gypsum crystal frame begins to break and crake,with the integrity being destroyed and intensity nearly lost.With higher temperature,the destruction of microstructure of thistle board will be more serious. |
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