| 王芸,安晓利,魏星,李瑞杰.铜导线短路熔痕微观形貌特征分析与研究[J].火灾科学,2008,17(1):44-48. |
| 铜导线短路熔痕微观形貌特征分析与研究 |
| Microstructure Study on Primary and Secondary Molten Marks of Copper Wires by SEM |
| 投稿时间：2007-09-02 修订日期：2007-12-24 |
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| DOI：10.3969/j.issn.1004-5309.年.期.顺序 |
| 基金项目: |
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| 中文关键词: 短路熔痕 扫描电子显微镜 微观形貌 气孔 |
| 英文关键词:the copper molten marks SEM microstructure pore |
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| 中文摘要: |
| 采用模拟实验的方法制备了铜导线一次短路熔痕和二次短路熔痕,利用KYKY-2800B型扫描电子显微镜(SEM)对铜导线一次短路熔痕和二次短路熔痕的微观形貌进行了观察,并对内部气孔的数量、大小、分布等进行了统计分析,发现了一次短路气孔的数量、分布与二次短路之间的差别与长期采用的鉴定依据不同。 |
| 英文摘要: |
| According to copper conducting wires’ melting marks forming rules,the samples were prepared by simulating actual fire scenes and the micro characteristics were observed by SEM.And that the pore size distribution were quantitatively studied by use of statistic analysis methods.The results show that the distinctness of pore’s quantities,pore size and spatial distribution between primary and secondary molten marks of copper wires are not same as the formerly checkup gist. |
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